Invention Grant
- Patent Title: Method and device for packaging a substrate
- Patent Title (中): 包装基材的方法和装置
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Application No.: US12192908Application Date: 2008-08-15
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Publication No.: US08045835B2Publication Date: 2011-10-25
- Inventor: Lauren Palmateer , William J. Cummings , Brian Gally , Mark Miles , Jeffrey B. Sampsell , Clarence Chui , Manish Kothari
- Applicant: Lauren Palmateer , William J. Cummings , Brian Gally , Mark Miles , Jeffrey B. Sampsell , Clarence Chui , Manish Kothari
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: G02B6/00
- IPC: G02B6/00

Abstract:
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
Public/Granted literature
- US20090059342A1 METHOD AND DEVICE FOR PACKAGING A SUBSTRATE Public/Granted day:2009-03-05
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