发明授权
US08053676B2 Substrate panel having a plurality of substrate strips for semiconductor packages
失效
具有多个用于半导体封装的衬底条的衬底面板
- 专利标题: Substrate panel having a plurality of substrate strips for semiconductor packages
- 专利标题(中): 具有多个用于半导体封装的衬底条的衬底面板
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申请号: US12191645申请日: 2008-08-14
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公开(公告)号: US08053676B2公开(公告)日: 2011-11-08
- 发明人: Wen-Jeng Fan
- 申请人: Wen-Jeng Fan
- 申请人地址: TW Hsinchu
- 专利权人: Powertech Technology Inc.
- 当前专利权人: Powertech Technology Inc.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Muncy, Geissler, Olds & Lowe, PLLC
- 主分类号: H05K1/03
- IPC分类号: H05K1/03 ; H05K7/00
摘要:
A substrate panel primarily comprises a plurality of substrate strips arranged in an array, one or more current input lines, a plurality of cascaded lines connecting between the substrate strips, and a current input buffer gate. Current input lines connect a current input side of the substrate panel to the adjacent substrate strips. The current input buffer gate has a frame around the substrate strips and a plurality of meshes where the frame intersects with the current input lines and the meshes intersect with the cascaded lines with both ends of the meshes connecting to the frame. Therefore, the current can be evenly distributed to each substrate strip during plating processes to improve the issues of different plating thicknesses and different plating roughness caused by different current densities and to protect the internal circuits inside the substrate strips from the damages due to current surges and unstable voltages.
公开/授权文献
- US20100038118A1 SUBSTRATE PANEL 公开/授权日:2010-02-18
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