Invention Grant
US08053906B2 Semiconductor package and method for processing and bonding a wire
有权
用于加工和焊接电线的半导体封装和方法
- Patent Title: Semiconductor package and method for processing and bonding a wire
- Patent Title (中): 用于加工和焊接电线的半导体封装和方法
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Application No.: US12501285Application Date: 2009-07-10
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Publication No.: US08053906B2Publication Date: 2011-11-08
- Inventor: Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung , Cheng Tsung Hsu , Chih Cheng Hung
- Applicant: Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung , Cheng Tsung Hsu , Chih Cheng Hung
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Priority: TW97133402A 20080901
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
Public/Granted literature
- US20100007009A1 SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE Public/Granted day:2010-01-14
Information query
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