公开(公告)号：US20100200981A1

公开(公告)日：2010-08-12

申请号：US12642081

申请日：2009-12-18

Applicant: Wen Pin HUANG ,  Cheng Tsung Hsu ,  Cheng Lan Tseng ,  Chih Cheng Hung

Inventor： Wen Pin HUANG ,  Cheng Tsung Hsu ,  Cheng Lan Tseng ,  Chih Cheng Hung

IPC: H01L23/49 ,  H01L21/56

CPC classification number: H01L24/45 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/00015 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/01001 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00013 ,  H01L2924/00011

Abstract: In a method of manufacturing a semiconductor package, a chip is disposed on a carrier. An inert gas is run around one end of a line portion of a copper bonding wire while the end is being formed into a spherical portion. The spherical portion is bonded to a pad of the chip. The chip and the copper bonding wire are sealed and the carrier is covered by a molding compound.

Abstract translation: 在制造半导体封装的方法中，芯片设置在载体上。 惰性气体在铜接合线的线部分的一端周围延伸，同时端部形成为球形部分。 球形部分结合到芯片的焊盘。 芯片和铜接合线被密封，载体被模塑料覆盖。

公开(公告)号：US08053906B2

公开(公告)日：2011-11-08

申请号：US12501285

申请日：2009-07-10

Applicant: Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Tsung Hsu ,  Chih Cheng Hung

Inventor： Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Tsung Hsu ,  Chih Cheng Hung

IPC: H01L23/48

CPC classification number: H01L24/85 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85047 ,  H01L2224/85201 ,  H01L2224/85365 ,  H01L2224/85947 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00012

Abstract: A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.

Abstract translation: 铜接合线包括线部分和非球形块部分。 非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。

公开(公告)号：US20100007009A1

公开(公告)日：2010-01-14

申请号：US12501285

申请日：2009-07-10

Applicant: Hsiao Chuan CHANG ,  Tsung Yueh TSAI ,  Yi Shao LAI ,  Ho Ming TONG ,  Jian Cheng CHEN ,  Wei Chi YIH ,  Chang Ying HUNG ,  Cheng Tsung HSU ,  Chih Cheng HUNG

Inventor： Hsiao Chuan CHANG ,  Tsung Yueh TSAI ,  Yi Shao LAI ,  Ho Ming TONG ,  Jian Cheng CHEN ,  Wei Chi YIH ,  Chang Ying HUNG ,  Cheng Tsung HSU ,  Chih Cheng HUNG

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H01L24/85 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85047 ,  H01L2224/85201 ,  H01L2224/85365 ,  H01L2224/85947 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00012

Abstract: A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.

Abstract translation: 铜接合线包括线部分和非球形块部分。 非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。

公开(公告)号：US20060091567A1

公开(公告)日：2006-05-04

申请号：US11163131

申请日：2005-10-06

Applicant: Yu-Liang Lin ,  Chih-Cheng Hung

Inventor： Yu-Liang Lin ,  Chih-Cheng Hung

IPC: H01L23/28

CPC classification number: H01L21/52 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for fabricating a cavity-down package is provided. A chip carrier includes a chip cavity. A chip is disposed inside the cavity, and a plurality of bonding materials is formed at the corners of the chip. The bonding materials are cured to protect the corners of the chip. Next, an encapsulant is formed in the cavity to seal the chip and the bonding materials to prevent stress concentration caused by thermal expansion mismatch on the chip corners and eliminate delamination between the encapsulant and the chip.

Abstract translation: 提供了一种制造腔体封装的方法。 芯片载体包括芯片腔。 芯片设置在空腔内，并且在芯片的角部形成多个接合材料。 固化粘合材料以保护芯片的角部。 接下来，在空腔中形成密封剂以密封芯片和接合材料，以防止由芯片角部的热膨胀失配引起的应力集中，并消除封装剂和芯片之间的分层。

公开(公告)号：US20100200969A1

公开(公告)日：2010-08-12

申请号：US12686979

申请日：2010-01-13

Applicant: Wen Pin HUANG ,  Cheng Tsung Hsu ,  Cheng Lan Tseng ,  Chih Cheng Hung ,  Yu Chi Chen

Inventor： Wen Pin HUANG ,  Cheng Tsung Hsu ,  Cheng Lan Tseng ,  Chih Cheng Hung ,  Yu Chi Chen

IPC: H01L23/48 ,  H01L23/495 ,  H01L21/50

CPC classification number: H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48847 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78302 ,  H01L2224/78822 ,  H01L2224/85181 ,  H01L2224/85206 ,  H01L2924/00015 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/013 ,  H01L2924/00012 ,  H01L2924/01205 ,  H01L2924/01204 ,  H01L2924/01203 ,  H01L2924/00013

Abstract: In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion.

Abstract translation: 在制造包括引线接合工艺的半导体封装的方法中，将接合线的第一端接合到第一焊盘以形成第一接合部分。 接合线的第二端接合到第二焊盘，其中接合线和第二焊盘之间的界面表面具有第一连接区域。 擦除粘合线的粘合的第二端以形成第二接合部分，其中接合线和第二焊盘之间的新的界面表面具有大于第一连接区域的第二连接区域。 接合线的其余部分与第二接合部分分离。

公开(公告)号：US08357998B2

公开(公告)日：2013-01-22

申请号：US12686979

申请日：2010-01-13

Applicant: Wen Pin Huang ,  Cheng Tsung Hsu ,  Cheng Lan Tseng ,  Chih Cheng Hung ,  Yu Chi Chen

Inventor： Wen Pin Huang ,  Cheng Tsung Hsu ,  Cheng Lan Tseng ,  Chih Cheng Hung ,  Yu Chi Chen

IPC: H01L23/48 ,  H01L23/495 ,  H01L21/50

CPC classification number: H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48847 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78302 ,  H01L2224/78822 ,  H01L2224/85181 ,  H01L2224/85206 ,  H01L2924/00015 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/013 ,  H01L2924/00012 ,  H01L2924/01205 ,  H01L2924/01204 ,  H01L2924/01203 ,  H01L2924/00013

Abstract: In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion.

Abstract translation: 在制造包括引线接合工艺的半导体封装的方法中，将接合线的第一端接合到第一焊盘以形成第一接合部分。 接合线的第二端接合到第二焊盘，其中接合线和第二焊盘之间的界面表面具有第一连接区域。 擦除粘合线的粘合的第二端以形成第二接合部分，其中接合线和第二焊盘之间的新的界面表面具有大于第一连接区域的第二连接区域。 接合线的其余部分与第二接合部分分离。

公开(公告)号：US06216825B1

公开(公告)日：2001-04-17

申请号：US09373992

申请日：1999-08-16

Applicant: Chih-Cheng Hung

Inventor： Chih-Cheng Hung

IPC: B62L300

CPC classification number: B62K23/06 ,  A61H3/04 ,  A61H2003/002 ,  A61H2003/004 ,  A61H2003/046 ,  Y10T74/20287 ,  Y10T74/2069

Abstract: A brake mechanism, which includes a mounting base fixedly fastened to the wheeled apparatus to be controlled, an actuating bar coupled between the mounting base and a brake cable at the wheeled apparatus, and a brake lever pivoted to the mounting base for operation by hand to move the actuating bar, wherein the brake lever is operated by hand and shifted between a first position where the brake cable is pulled up to stop the wheeled apparatus and the brake cable will be released when releasing the brake lever from the hand, a second position where the brake mechanism stands idle, and a third position where the brake cable is maintained pulled up and will not be released from the braking position when releasing the brake lever from the hand.

Abstract translation: 一种制动机构，其包括固定地固定到要被控制的轮式装置的安装基座，联接在所述安装基座和所述轮式装置处的制动缆索之间的致动杆，以及枢转到所述安装基座的制动杆，用于手动操作 移动所述致动杆，其中所述制动杆由手操作并在所述制动缆索被拉起的第一位置之间移动以停止所述轮式装置，并且当从所述手释放所述制动杆时所述制动缆索将被释放;第二位置 其中制动机构处于空闲状态，以及第三位置，其中制动缆索被保持上拉，并且在从手释放制动杆时不会从制动位置释放。