发明授权
US08057906B2 Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device
有权
降低硅橡胶固化产物的表面粘性的方法，用于密封半导体的液体硅橡胶组合物，硅橡胶密封半导体器件以及半导体器件的制造方法
- 专利标题： Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device
- 专利标题（中）： 降低硅橡胶固化产物的表面粘性的方法，用于密封半导体的液体硅橡胶组合物，硅橡胶密封半导体器件以及半导体器件的制造方法
-
申请号： US11529312申请日： 2006-09-29
-
公开(公告)号： US08057906B2公开(公告)日： 2011-11-15
- 发明人: Tsutomu Kashiwagi , Toshio Shiobara , Masanobu Sato , Koki Matsumoto
- 申请人： Tsutomu Kashiwagi , Toshio Shiobara , Masanobu Sato , Koki Matsumoto
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2005-288916 20050930
- 主分类号： B32B9/04
- IPC分类号： B32B9/04
摘要：
A method of reducing surface tackiness of a silicone rubber cured product is provided. The method includes coating the surface of a cured product of a curable silicone rubber composition, which has a molar ratio within the composition of hydrogen atoms bonded to silicon atoms relative to alkenyl groups bonded to silicon atoms of 1.0 or greater, and which, following curing, exhibits a type A hardness prescribed in JIS K6253 of no more than 20, with a curable silicone resin layer which, following curing, exhibits a type D hardness prescribed in JIS K6253 of 30 or greater; and subsequently curing the silicone resin to form a cured resin layer with a thickness of no more than 0.5 mm. Adhesion of dirt to the surface can be prevented.
信息查询
