发明授权
US08063143B2 Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor
有权
固化有机聚硅氧烷组合物，其固化方法，半导体器件和粘合促进剂
- 专利标题： Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor
- 专利标题（中）： 固化有机聚硅氧烷组合物，其固化方法，半导体器件和粘合促进剂
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申请号： US12888050申请日： 2010-09-22
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公开(公告)号： US08063143B2公开(公告)日： 2011-11-22
- 发明人: Yoshitsugu Morita , Tomoko Kato , Hiroshi Ueki
- 申请人： Yoshitsugu Morita , Tomoko Kato , Hiroshi Ueki
- 申请人地址： JP Chiyoda-ku, Tokyo
- 专利权人： Dow Corning Toray Co., Ltd.
- 当前专利权人： Dow Corning Toray Co., Ltd.
- 当前专利权人地址： JP Chiyoda-ku, Tokyo
- 代理机构： Howard & Howard Attorneys PLLC
- 优先权： JP2004-222072 20040729; JP2004-237719 20040817; WOPCT/JP2005/014354 20050728
- 主分类号： C08L83/05
- IPC分类号： C08L83/05
摘要：
A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.
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