发明授权
US08067769B2 Wafer level package structure, and sensor device obtained from the same package structure
失效
晶圆级封装结构，以及从相同封装结构获得的传感器器件
- 专利标题： Wafer level package structure, and sensor device obtained from the same package structure
- 专利标题（中）： 晶圆级封装结构，以及从相同封装结构获得的传感器器件
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申请号： US12094674申请日： 2006-11-24
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公开(公告)号： US08067769B2公开(公告)日： 2011-11-29
- 发明人: Takafumi Okudo , Yuji Suzuki , Yoshiyuki Takegawa , Toru Baba , Kouji Gotou , Hisakazu Miyajima , Kazushi Kataoka , Takashi Saijo
- 申请人： Takafumi Okudo , Yuji Suzuki , Yoshiyuki Takegawa , Toru Baba , Kouji Gotou , Hisakazu Miyajima , Kazushi Kataoka , Takashi Saijo
- 申请人地址： JP Osaka
- 专利权人： Panasonic Electric Works Co., Ltd.
- 当前专利权人： Panasonic Electric Works Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Cheng Law Group, PLLC
- 优先权： JP2005-341223 20051125; JP2005-341225 20051125; JP2005-341253 20051125; JP2005-371049 20051222; JP2005-371053 20051222; JP2006-089558 20060328; JP2006-089589 20060328
- 国际申请： PCT/JP2006/323453 WO 20061124
- 国际公布： WO2007/061054 WO 20070531
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.