发明授权
US08067818B2 Nonplanar device with thinned lower body portion and method of fabrication
有权
具有减薄的下体部分的非平面装置和制造方法
- 专利标题: Nonplanar device with thinned lower body portion and method of fabrication
- 专利标题(中): 具有减薄的下体部分的非平面装置和制造方法
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申请号: US12954241申请日: 2010-11-24
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公开(公告)号: US08067818B2公开(公告)日: 2011-11-29
- 发明人: Uday Shah , Brian Doyle , Justin K. Brask , Robert S. Chau , Thomas A. Letson
- 申请人: Uday Shah , Brian Doyle , Justin K. Brask , Robert S. Chau , Thomas A. Letson
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L29/06
- IPC分类号: H01L29/06
摘要:
A nonplanar semiconductor device having a semiconductor body formed on an insulating layer of a substrate. The semiconductor body has a top surface opposite a bottom surface formed on the insulating layer and a pair of laterally opposite sidewalls wherein the distance between the laterally opposite sidewalls at the top surface is greater than at the bottom surface. A gate dielectric layer is formed on the top surface of the semiconductor body and on the sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric layer on the top surface and sidewalls of the semiconductor body. A pair of source/drain regions are formed in the semiconductor body on opposite sides of the gate electrode.
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