发明授权
- 专利标题： Method for the wet-chemical treatment of a semiconductor wafer
- 专利标题（中）： 半导体晶片的湿化学处理方法
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申请号： US12326969申请日： 2008-12-03
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公开(公告)号： US08070882B2公开(公告)日： 2011-12-06
- 发明人: Guenter Schwab , Clemens Zapilko , Thomas Buschhardt , Diego Feijoo , Teruo Haibara , Yoshihiro Mori
- 申请人： Guenter Schwab , Clemens Zapilko , Thomas Buschhardt , Diego Feijoo , Teruo Haibara , Yoshihiro Mori
- 申请人地址： DE Munich
- 专利权人： Siltronic AG
- 当前专利权人： Siltronic AG
- 当前专利权人地址： DE Munich
- 代理机构： Brooks Kushman P.C.
- 优先权： DE102007058503 20071205
- 主分类号： B08B7/00
- IPC分类号： B08B7/00
摘要：
A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 μm or less to the rotating wafer such that a liquid film forms on the wafer; c) exposing the rotating semiconductor wafer to a gas atmosphere containing a reactive gas; and d) removing the liquid film from the wafer.
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