Invention Grant
- Patent Title: Fabrication method of light emitting diode
- Patent Title (中): 发光二极管的制造方法
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Application No.: US12542703Application Date: 2009-08-18
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Publication No.: US08071409B2Publication Date: 2011-12-06
- Inventor: Te-Chung Wang , Chun-Jong Chang , Kun-Fu Huang
- Applicant: Te-Chung Wang , Chun-Jong Chang , Kun-Fu Huang
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corp.
- Current Assignee: Lextar Electronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Liu & Liu
- Priority: TW98115169A 20090507
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00

Abstract:
A fabrication method of light emitting diode is provided. A first type doped semiconductor layer is formed on a substrate. Subsequently, a light emitting layer is formed on the first type doped semiconductor layer. A process for forming the light emitting layer includes alternately forming a plurality of barrier layers and a plurality of quantum well layers on the first type doped semiconductor layer. The quantum well layers are formed at a growth temperature T1, and the barrier layers are formed at a growth temperature T2, where T1
Public/Granted literature
- US20100285626A1 FABRICATION METHOD OF LIGHT EMITTING DIODE Public/Granted day:2010-11-11
Information query
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