发明授权
- 专利标题: Semiconductor device with solder balls having high reliability
- 专利标题(中): 具有焊球的半导体器件具有高可靠性
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申请号: US12706440申请日: 2010-02-16
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公开(公告)号: US08071472B2公开(公告)日: 2011-12-06
- 发明人: Fumiyoshi Kawashiro
- 申请人: Fumiyoshi Kawashiro
- 申请人地址: JP Tokyo
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2005-314150 20051028
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
A semiconductor device includes a substrate, a metal layer, an alloy layer and a Sn—Ag—Cu-based solder ball. The metal layer is configured to be formed on the substrate. The alloy layer is configured to be formed on the metal layer. The Sn—Ag—Cu-based solder ball is configured to be placed on the alloy layer. The alloy layer includes Ni and Zn as essential elements.
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