发明授权
- 专利标题: Microchip
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申请号: US12270942申请日: 2008-11-14
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公开(公告)号: US08075853B2公开(公告)日: 2011-12-13
- 发明人: Hidetaka Okada , Yasuhisa Kageyama , Shun Momose , Youichi Aoki
- 申请人: Hidetaka Okada , Yasuhisa Kageyama , Shun Momose , Youichi Aoki
- 申请人地址: JP Kyoto
- 专利权人: Rohm Co., Ltd.
- 当前专利权人: Rohm Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Fish & Richardson P.C.
- 优先权: JP2007-298221 20071116; JP2007-298222 20071116; JP2007-334240 20071226; JP2007-336853 20071227; JP2007-339570 20071228; JP2008-126198 20080513; JP2008-149220 20080606; JP2008-288633 20081111
- 主分类号: B01L3/00
- IPC分类号: B01L3/00 ; G01N1/10
摘要:
The present invention provides a microchip which is made by bonding a first substrate having a groove provided at the substrate surface and a second substrate together, and has a fluid circuit therein, the fluid circuit having a separation portion for separating a first component, and a groove which constitutes the separation portion including an approximately V-shaped region surrounded by prescribed flow channel walls. At a top of the separation portion, a flow rate limiting portion limiting a flow rate of a fluid is preferably provided.
公开/授权文献
- US20090142232A1 MICROCHIP 公开/授权日:2009-06-04
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