发明授权
- 专利标题： Power module assembly with reduced inductance
- 专利标题（中）： 功率模块组件具有降低的电感
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申请号： US12609400申请日： 2009-10-30
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公开(公告)号： US08076696B2公开(公告)日： 2011-12-13
- 发明人: Richard Alfred Beaupre , Eladio Clemente Delgado , Ljubisa Dragoljub Stevanovic
- 申请人： Richard Alfred Beaupre , Eladio Clemente Delgado , Ljubisa Dragoljub Stevanovic
- 申请人地址： US NY Niskayuna
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： US NY Niskayuna
- 代理商 Richard D. Emery
- 主分类号： H01L31/111
- IPC分类号： H01L31/111
摘要：
A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal can also be electrically coupled to the first conductive substrate, while a negative terminal can be electrically coupled to the second power semiconductor component, and an output terminal may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.
公开/授权文献
- US20110101515A1 POWER MODULE ASSEMBLY WITH REDUCED INDUCTANCE 公开/授权日：2011-05-05
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