Invention Grant
- Patent Title: Interconnecting modular headers and header assemblies thereof
- Patent Title (中): 互连模块化头部和头部组件
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Application No.: US12670673Application Date: 2008-07-16
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Publication No.: US08079882B2Publication Date: 2011-12-20
- Inventor: Matthew Bailey , Michael Gonzalez , Christopher Dillon
- Applicant: Matthew Bailey , Michael Gonzalez , Christopher Dillon
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Larry I. Golden
- International Application: PCT/US2008/008663 WO 20080716
- International Announcement: WO2009/017599 WO 20090205
- Main IPC: H01R9/22
- IPC: H01R9/22

Abstract:
Interconnecting modular connectors or headers have flexible tongue and groove structures for forming a variety of header assembly configurations. The interconnecting modular headers can have locking structures in addition to the tongue and groove mating structures for permanently interlocking the modular headers together. The sidewalls of each modular connector can be parallel to each other and disposed at supplementary angles with respect to the rear wall of the housing. The top wall of each modular connector can have a portion wall extending inwardly from each sidewall at an angle of greater than ninety degrees and each portion wall can have an upwardly extending wall that joins the portion walls to a ceiling. The portion walls can join with the upwardly extending walls to form a T-shape corner. The upwardly extending walls can join with the ceiling equally at an angle of greater than ninety degrees.
Public/Granted literature
- US20100240256A1 INTERCONNECTING MODULAR HEADERS AND HEADER ASSEMBLIES THEREOF Public/Granted day:2010-09-23
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