An apparatus and method for forming an opening in a base-metal layer of an electrical lead suspension (ELS) to increase the impedance. The method provides a base-metal layer having at least one opening. A dielectric layer above the base-metal layer is also provided, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is aligned above the portion of the dielectric layer covering at least one of the openings in the base-metal layer. By aligning the at least one solder pad portion over the opening of the base-metal layer the solder pad to base-metal layer the impedance between the at least one solder pad portion and the base-metal layer is increased.