发明授权
- 专利标题： Substrate treatment method
- 专利标题（中）： 底物处理方法
-
申请号： US11542138申请日： 2006-10-04
-
公开(公告)号： US08088693B2公开(公告)日： 2012-01-03
- 发明人: Yoshimichi Shiki , Seiji Oda , Hayato Iwamoto , Yoshiya Hagimoto
- 申请人： Yoshimichi Shiki , Seiji Oda , Hayato Iwamoto , Yoshiya Hagimoto
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Rader, Fishman & Grauer PLLC
- 优先权： JPP2005-299579 20051014; JPP2006-216540 20060809
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.
公开/授权文献
- US20070105242A1 Substrate treatment method 公开/授权日：2007-05-10
信息查询
IPC分类:
