Invention Grant
US08093699B2 Circuit device with circuit board and semiconductor chip mounted thereon
有权
具有安装在其上的电路板和半导体芯片的电路装置
- Patent Title: Circuit device with circuit board and semiconductor chip mounted thereon
- Patent Title (中): 具有安装在其上的电路板和半导体芯片的电路装置
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Application No.: US11313743Application Date: 2005-12-22
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Publication No.: US08093699B2Publication Date: 2012-01-10
- Inventor: Yasuhiro Kohara , Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
- Applicant: Yasuhiro Kohara , Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2004-370774 20041222
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.
Public/Granted literature
- US20060131746A1 Circuit device Public/Granted day:2006-06-22
Information query
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