发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
-
申请号： US12364340申请日： 2009-02-02
-
公开(公告)号： US08093711B2公开(公告)日： 2012-01-10
- 发明人: Frank Zudock , Thorsten Meyer , Markus Brunnbauer , Andreas Wolter
- 申请人： Frank Zudock , Thorsten Meyer , Markus Brunnbauer , Andreas Wolter
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L23/04
- IPC分类号： H01L23/04
摘要：
A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially encapsulating the semiconductor chip, and a first metal layer disposed over the encapsulation material and connected with the through-connection.
公开/授权文献
- US20100193928A1 SEMICONDUCTOR DEVICE 公开/授权日：2010-08-05
信息查询
IPC分类:
