发明授权
- 专利标题： Headset
- 专利标题（中）： 耳机
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申请号： US11893883申请日： 2007-08-16
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公开(公告)号： US08094852B2公开(公告)日： 2012-01-10
- 发明人: Michihito Ikuma , Yasuhisa Kaneda
- 申请人： Michihito Ikuma , Yasuhisa Kaneda
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Frommer Lawrence & Haug LLP
- 代理商 William S. Frommer; Ellen Marcie Emas
- 优先权： JPP2006-223047 20060818
- 主分类号： H04R25/00
- IPC分类号： H04R25/00
摘要：
A headset for using an electronic device worn on a head, includes an ear clip formed to have a shape conforming to and wearable on a root of auricle. The ear clip includes a core that can plastically be deformed according to a difference between shapes of the root of auricle and a protecting material that covers the core.
公开/授权文献
- US20080044051A1 Headset 公开/授权日：2008-02-21
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