发明授权
- 专利标题: Die package with asymmetric leadframe connection
- 专利标题(中): 具有不对称引线框架连接的芯片封装
-
申请号: US12060418申请日: 2008-04-01
-
公开(公告)号: US08097495B2公开(公告)日: 2012-01-17
- 发明人: Ming Hsun Lee , Chih-Chin Liao , Cheemen Yu , Hem Takiar
- 申请人: Ming Hsun Lee , Chih-Chin Liao , Cheemen Yu , Hem Takiar
- 申请人地址: US TX Plano
- 专利权人: SanDisk Technologies Inc.
- 当前专利权人: SanDisk Technologies Inc.
- 当前专利权人地址: US TX Plano
- 代理机构: Vierra Magen Marcus & DeNiro LLP
- 主分类号: H01L21/50
- IPC分类号: H01L21/50 ; H01L21/56 ; H01L21/60
摘要:
A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be made with the semiconductor die at the second side of the leadframe. The semiconductor die may be supported on the leads extending across the leadframe. The package may further include a spacer layer affixed to the electrical leads to fortify the semiconductor package and to prevent exposure of the electrical leads during the molding of the package.
公开/授权文献
- US20080182365A1 DIE PACKAGE WITH ASYMMETRIC LEADFRAME CONNECTION 公开/授权日:2008-07-31