A method for manufacturing a circuit board includes the following steps. First, a core layer is provided, wherein the core layer includes a first dielectric layer, and first and second metallic layers. A through hole is formed in the core layer. The core layer is disposed on a supporting plate, and an embedded component is disposed in the through hole, wherein the second metallic layer contacts the supporting plate, and the embedded component has at least one electrode contacting the supporting plate. The embedded component is mounted in the through hole. The supporting plate is removed. The first and second metallic layers are removed, and the thickness of the electrode of the embedded component is decreased. Third and fourth metallic layers are formed respectively, wherein the fourth metallic layer is electrically connected to the electrode of the embedded component. Finally, the third and fourth metallic layers are patterned so as to respectively form first and second patterned circuit layers.