公开(公告)号：US08099865B2

公开(公告)日：2012-01-24

申请号：US12142853

申请日：2008-06-20

申请人： Yung Hui Wang ,  Ying Te Ou

发明人： Yung Hui Wang ,  Ying Te Ou

IPC分类号： H05K3/04 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/426 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/025 ,  H05K2203/1152 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/82

摘要： A method for manufacturing a circuit board includes the following steps. First, a core layer is provided, wherein the core layer includes a first dielectric layer, and first and second metallic layers. A through hole is formed in the core layer. The core layer is disposed on a supporting plate, and an embedded component is disposed in the through hole, wherein the second metallic layer contacts the supporting plate, and the embedded component has at least one electrode contacting the supporting plate. The embedded component is mounted in the through hole. The supporting plate is removed. The first and second metallic layers are removed, and the thickness of the electrode of the embedded component is decreased. Third and fourth metallic layers are formed respectively, wherein the fourth metallic layer is electrically connected to the electrode of the embedded component. Finally, the third and fourth metallic layers are patterned so as to respectively form first and second patterned circuit layers.

摘要翻译： 一种制造电路板的方法包括以下步骤。 首先，提供芯层，其中芯层包括第一介电层以及第一和第二金属层。 在芯层中形成通孔。 芯层设置在支撑板上，并且嵌入部件设置在通孔中，其中第二金属层接触支撑板，并且嵌入部件具有与支撑板接触的至少一个电极。 嵌入式组件安装在通孔中。 取下支撑板。 第一和第二金属层被去除，并且嵌入部件的电极的厚度减小。 分别形成第三和第四金属层，其中第四金属层电连接到嵌入部件的电极。 最后，第三和第四金属层被图案化以分别形成第一和第二图案化电路层。

公开(公告)号：US20080145589A1

公开(公告)日：2008-06-19

申请号：US11870620

申请日：2007-10-11

申请人： Chih Pin Hung ,  Chi Tsung Chiu ,  In De Ou ,  Yung Hui Wang

发明人： Chih Pin Hung ,  Chi Tsung Chiu ,  In De Ou ,  Yung Hui Wang

IPC分类号： B32B1/02

CPC分类号： H05K1/144 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K2201/042 ,  H05K2201/10977 ,  H05K2203/049 ,  Y10T428/23 ,  H01L2224/0401 ,  H01L2924/00012

摘要： An electronic package is provided. The electronic package includes a first substrate, an electronic component, a first sealant, a second substrate, a plurality of bonding wires and a second sealant, wherein the first substrate has opposing upper and lower surfaces and a plurality of bonding pads is disposed on the upper surface of the first substrate. The electronic component is positioned on the upper surface of the first substrate and electrically connected to the bonding pads. The first sealant is formed on the upper surface of the first substrate to encapsulate the electronic component. The lower surface of the second substrate is attached to the first sealant. The upper surface of the second substrate includes a central protrusion and a rim portion which surrounds and is lower than the central protrusion. A plurality of bonding wires is used to electrically connect the rim portion to the first substrate. The second sealant is formed on the upper surface of the first substrate and on the rim portion of the second substrate to encapsulate the bonding wires, the first sealant and the rim portion.

摘要翻译： 提供电子包装。 电子封装包括第一基板，电子部件，第一密封剂，第二基板，多个接合线和第二密封剂，其中第一基板具有相对的上表面和下表面，并且多个接合焊盘设置在 第一基板的上表面。 电子部件位于第一基板的上表面上并电连接到接合焊盘。 第一密封剂形成在第一基板的上表面上以封装电子部件。 第二基板的下表面附接到第一密封剂。 第二基板的上表面包括中心突起和围绕中心突起的边缘部分。 使用多个接合线将边缘部分电连接到第一基板。 第二密封剂形成在第一基板的上表面和第二基板的边缘部分上，以封装接合线，第一密封剂和边缘部分。

公开(公告)号：US07586184B2

公开(公告)日：2009-09-08

申请号：US11870620

申请日：2007-10-11

申请人： Chih Pin Hung ,  Chi Tsung Chiu ,  In De Ou ,  Yung Hui Wang

发明人： Chih Pin Hung ,  Chi Tsung Chiu ,  In De Ou ,  Yung Hui Wang

IPC分类号： H01L23/498

CPC分类号： H05K1/144 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K2201/042 ,  H05K2201/10977 ,  H05K2203/049 ,  Y10T428/23 ,  H01L2224/0401 ,  H01L2924/00012

摘要： An electronic package is provided. The electronic package includes a first substrate, an electronic component, a first sealant, a second substrate, a plurality of bonding wires and a second sealant, wherein the first substrate has opposing upper and lower surfaces and a plurality of bonding pads is disposed on the upper surface of the first substrate. The electronic component is positioned on the upper surface of the first substrate and electrically connected to the bonding pads. The first sealant is formed on the upper surface of the first substrate to encapsulate the electronic component. The lower surface of the second substrate is attached to the first sealant. The upper surface of the second substrate includes a central protrusion and a rim portion which surrounds and is lower than the central protrusion. A plurality of bonding wires is used to electrically connect the rim portion to the first substrate. The second sealant is formed on the upper surface of the first substrate and on the rim portion of the second substrate to encapsulate the bonding wires, the first sealant and the rim portion.

摘要翻译： 提供电子包装。 电子封装包括第一基板，电子部件，第一密封剂，第二基板，多个接合线和第二密封剂，其中第一基板具有相对的上表面和下表面，并且多个接合焊盘设置在 第一基板的上表面。 电子部件位于第一基板的上表面上并电连接到接合焊盘。 第一密封剂形成在第一基板的上表面上以封装电子部件。 第二基板的下表面附接到第一密封剂。 第二基板的上表面包括中心突起和围绕中心突起的边缘部分。 使用多个接合线将边缘部分电连接到第一基板。 第二密封剂形成在第一基板的上表面和第二基板的边缘部分上，以封装接合线，第一密封剂和边缘部分。