发明授权
US08099866B2 Conductor-clad laminate, wiring circuit board, and processes for producing the same 失效
导线覆层压板,布线电路板及其制造方法

  • 专利标题: Conductor-clad laminate, wiring circuit board, and processes for producing the same
  • 专利标题(中): 导线覆层压板,布线电路板及其制造方法
  • 申请号: US11603048
    申请日: 2006-11-22
  • 公开(公告)号: US08099866B2
    公开(公告)日: 2012-01-24
  • 发明人: Daisuke Yamauchi
  • 申请人: Daisuke Yamauchi
  • 申请人地址: JP Ibaraki-Shi
  • 专利权人: Nitto Denko Corporation
  • 当前专利权人: Nitto Denko Corporation
  • 当前专利权人地址: JP Ibaraki-Shi
  • 代理机构: Sughrue Mion, PLLC
  • 优先权: JPP.2005-337993 20051124
  • 主分类号: H05K3/10
  • IPC分类号: H05K3/10
Conductor-clad laminate, wiring circuit board, and processes for producing the same
摘要:
In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150° C. to thereby form an adhesive layer 2. Subsequently, an insulating film 3 including a polyimide film is laminated on the adhesive layer 2 at room temperature (about 25° C.) to thereby produce a layered product 6 including the release film 1, adhesive layer 2 and insulating film 3. Next, the release film 1 is stripped from the layered product 6 and a conductor film 4 including a copper foil is laminated to the adhesive layer 2 to thereby produce a conductor-clad laminate 8.
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