发明授权
- 专利标题: Bonded intermediate substrate and method of making same
- 专利标题(中): 粘合中间基材及其制备方法
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申请号: US11408239申请日: 2006-04-21
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公开(公告)号: US08101498B2公开(公告)日: 2012-01-24
- 发明人: Thomas Henry Pinnington , James M. Zahler , Young-Bae Park , Charles Tsai , Corinne Ladous , Harry A. Atwater, Jr. , Sean Olson
- 申请人: Thomas Henry Pinnington , James M. Zahler , Young-Bae Park , Charles Tsai , Corinne Ladous , Harry A. Atwater, Jr. , Sean Olson
- 主分类号: H01L21/30
- IPC分类号: H01L21/30 ; H01L21/46
摘要:
An intermediate substrate includes a handle substrate bonded to a thin layer suitable for epitaxial growth of a compound semiconductor layer, such as a III-nitride semiconductor layer. The handle substrate may be a metal or metal alloy substrate, such as a molybdenum or molybdenum alloy substrate, while the thin layer may be a sapphire layer. A method of making the intermediate substrate includes forming a weak interface in the source substrate, bonding the source substrate to the handle substrate, and exfoliating the thin layer from the source substrate such that the thin layer remains bonded to the handle substrate.
公开/授权文献
- US20060255341A1 Bonded intermediate substrate and method of making same 公开/授权日:2006-11-16
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