发明授权
US08101511B2 Method of manufacturing a junction barrier Schottky diode with dual silicides
有权
制造具有双重硅化物的结屏障肖特基二极管的方法
- 专利标题: Method of manufacturing a junction barrier Schottky diode with dual silicides
- 专利标题(中): 制造具有双重硅化物的结屏障肖特基二极管的方法
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申请号: US12774762申请日: 2010-05-06
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公开(公告)号: US08101511B2公开(公告)日: 2012-01-24
- 发明人: Dev Alok Girdhar , Michael David Church , Alexander Kalnitsky
- 申请人: Dev Alok Girdhar , Michael David Church , Alexander Kalnitsky
- 申请人地址: US CA Milpitas
- 专利权人: Intersil Americas Inc.
- 当前专利权人: Intersil Americas Inc.
- 当前专利权人地址: US CA Milpitas
- 代理机构: Barnes & Thornburg, LLP
- 主分类号: H01L21/28
- IPC分类号: H01L21/28 ; H01L21/44
摘要:
An integrated circuit, including a junction barrier Schottky diode, has an N type well, a P-type anode region in the surface of the well, and an N-type Schottky region in the surface of the well and horizontally abutting the anode region. A first silicide layer is on and makes a Schottky contact to the Schottky region and is on an adjoining anode region. A second silicide layer of a different material than the first silicide is on the anode region. An ohmic contact is made to the second silicide on the anode region and to the well.
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