A dielectric ceramic composition comprises as a main component, Cu oxide, Si oxide and one selected from the group consisting of Zn oxide alone and a combination of Mg oxide and Zn oxide, as a subcomponent, a glass component including B oxide and at least one selected from the group consisting of Si oxide, Ba oxide, Ca oxide, Sr oxide, Li oxide and Zn oxide, and having a glass softening point is 750° C. or less, wherein a content of said glass component is 1.5 to 15 wt % with respect to 100 wt % of said main component. According to the present invention, a dielectric ceramic composition can be provided which is available to be sintered at low temperature (for example, 950° C. or lower) while comparatively decreasing contents of a glass component, which shows good properties (specific permittivity, loss Q value and insulation resistance), and which is available to perform cofiring different materials.