A chip package structure with a shielding cover includes a substrate, a chip, a pair of first passive components, a pair of second passive components, and a shielding cover. The chip, the pair of first passive components, the pair of second passive components, and the shielding cover are disposed on the substrate. The chip is electrically connected to the substrate. The shielding cover covers the chip and has leads connected to the substrate. The leads include a first lead and a second lead. The first lead connected to a portion of the substrate is located between the pair of first passive components and arranged along a first axis with the pair of first passive components. The second lead connected to a portion of the substrate is located between the pair of second passive components and arranged along a second axis with the pair of second passive components.