Invention Grant
US08105655B2 Fast and low temperature cured polyimide fuser belt 有权
快速和低温固化聚酰亚胺定影带

Fast and low temperature cured polyimide fuser belt
Abstract:
Exemplary embodiments provide a belt material and methods for making and using the belt material. In one embodiment, the belt material can be a fast and low-temperature cured polyimide belt that includes a plurality of thermally-conductive species dispersed in a polyimide resin. In another embodiment, the belt material can include one or more layers formed over the fast and low-temperature cured polyimide belt substrate that includes a plurality of thermally-conductive species dispersed in the polyimide resin. For example, the fast and low-temperature cured polyimide belt or belt substrate can be cured at a temperature of about 300° C. or lower for a time length of less than about one hour. The belt material can be suitable for use in an electrostatographic printing process as a fuser belt, a fixing belt, a pressure belt, and/or a release agent donor belt.
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