Invention Grant
- Patent Title: Fast and low temperature cured polyimide fuser belt
- Patent Title (中): 快速和低温固化聚酰亚胺定影带
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Application No.: US12164613Application Date: 2008-06-30
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Publication No.: US08105655B2Publication Date: 2012-01-31
- Inventor: Jin Wu
- Applicant: Jin Wu
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: B05D3/02
- IPC: B05D3/02

Abstract:
Exemplary embodiments provide a belt material and methods for making and using the belt material. In one embodiment, the belt material can be a fast and low-temperature cured polyimide belt that includes a plurality of thermally-conductive species dispersed in a polyimide resin. In another embodiment, the belt material can include one or more layers formed over the fast and low-temperature cured polyimide belt substrate that includes a plurality of thermally-conductive species dispersed in the polyimide resin. For example, the fast and low-temperature cured polyimide belt or belt substrate can be cured at a temperature of about 300° C. or lower for a time length of less than about one hour. The belt material can be suitable for use in an electrostatographic printing process as a fuser belt, a fixing belt, a pressure belt, and/or a release agent donor belt.
Public/Granted literature
- US20090324959A1 FAST AND LOW TEMPERATURE CURED POLYIMIDE FUSER BELT Public/Granted day:2009-12-31
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