发明授权
US08105878B2 Manufacturing method of a semiconductor device having a package dicing
有权
具有封装切割的半导体器件的制造方法
- 专利标题: Manufacturing method of a semiconductor device having a package dicing
- 专利标题(中): 具有封装切割的半导体器件的制造方法
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申请号: US11833606申请日: 2007-08-03
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公开(公告)号: US08105878B2公开(公告)日: 2012-01-31
- 发明人: Haruhiko Harada , Takao Matsuura
- 申请人: Haruhiko Harada , Takao Matsuura
- 申请人地址: JP Kanagawa
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kanagawa
- 代理机构: Mattingly & Malur, PC
- 优先权: JP2006-257690 20060922
- 主分类号: H01L25/50
- IPC分类号: H01L25/50 ; H01L21/56 ; H01L21/58 ; H01L33/48
摘要:
A thermosetting tape is adopted as a dicing tape and, after package dicing, the thermosetting tape is heated, then a desired one of divided CSPs is picked up by an inverting collet. Since the thermosetting tape is heated o a predetermined temperature so that its adhesive force becomes zero, the CSP can be picked up by the inverting collet without peeling it off from the thermosetting tape. Thus, peel-off charging does not occur and therefore it is not necessary to perform a destaticizing process. As a result, it is possible to improve the production efficiency in assembling the semiconductor device (CSP).
公开/授权文献
- US20080076210A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 公开/授权日:2008-03-27