发明授权
US08105889B2 Methods of fabricating transistors including self-aligned gate electrodes and source/drain regions 有权
制造晶体管的方法包括自对准栅电极和源/漏区

Methods of fabricating transistors including self-aligned gate electrodes and source/drain regions
摘要:
Methods of forming Group III-nitride transistor device include forming a protective layer on a Group III-nitride semiconductor layer, forming a via hole through the protective layer to expose a portion of the Group III-nitride semiconductor layer, and forming a masking gate on the protective layer. The masking gate includes an upper portion having a width that is larger than a width of the via hole and having a lower portion extending into the via hole. The methods further include implanting source/drain regions in the Group III-nitride semiconductor layer using the masking gate as an implant mask.
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