A printed circuit board for a package includes a first insulation layer, on one side of which an electronic component having a plurality of electrical contacts is mounted; a plurality of first bond pads formed on the other side of the first insulation layer in predetermined intervals, which are electrically connected with the electrical contacts; a second insulation layer stacked on the other side of the first insulation layer, with those portions removed where the first bond pads are formed; and a second bond pad, which is formed on a surface of the second insulation layer in correspondence with positions between the plurality of the first bond pads, and which is electrically connected with the electrical contacts. The bond pads can be implemented in two layers, as opposed to the case of forming the bond pads in one layer, in a predetermined area of a printed circuit board.