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    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
    印刷电路板及其制造方法

    公开(公告)号：US20100122842A1

    公开(公告)日：2010-05-20

    申请号：US12428776

    申请日：2009-04-23

    申请人： Tae-Gui KIM ,  Young-Hwan Shin ,  Jae-Soo Lee ,  Tae-Gon Lee

    发明人： Tae-Gui KIM ,  Young-Hwan Shin ,  Jae-Soo Lee ,  Tae-Gon Lee

    IPC分类号： H01R12/06 ,  H05K3/00

    CPC分类号： H05K3/0035 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/108 ,  H05K3/243 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09736 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board including a via, which is configured to electrically connect both sides of an insulator, and a pad part, which is formed in one side of the insulator to be directly in contact with the via, can include forming a seed layer part on one side of the insulator, a portion of the seed layer part being bulged, forming a via hole by processing the other side of the insulator, corresponding to the bulged portion of the seed layer part, forming the via inside the via hole, and forming a plating layer, corresponding to the pad part, on the seed layer part. With the present invention, it is possible to form a pattern having a finer pitch, maintaining a VOP structure and to prevent a lower side of a substrate from being penetrated through when a via hole is processed.

    摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 制造包括通孔的印刷电路板的制造方法，该印刷电路板被配置为电连接绝缘体的两侧，并且形成在绝缘体的一个侧面中以与通孔直接接触的焊盘部分可以包括成形 种子层部分在绝缘体的一侧上，种子层部分的一部分被凸出，通过处理绝缘体的另一侧形成通孔，对应于种子层部分的凸起部分，在该内部形成通孔 并且在种子层部分上形成对应于焊盘部分的镀层。 利用本发明，可以形成具有更细的间距的图案，保持VOP结构并且防止当加工通孔时衬底的下侧被穿透。

    Printed circuit board and manufacturing method thereof
    8.
    发明授权
    Printed circuit board and manufacturing method thereof 有权
    印刷电路板及其制造方法

    公开(公告)号：US08084696B2

    公开(公告)日：2011-12-27

    申请号：US12428776

    申请日：2009-04-23

    申请人： Tae-Gui Kim ,  Young-Hwan Shin ,  Jae-Soo Lee ,  Tae-Gon Lee

    发明人： Tae-Gui Kim ,  Young-Hwan Shin ,  Jae-Soo Lee ,  Tae-Gon Lee

    IPC分类号： H05K1/11

    CPC分类号： H05K3/0035 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/108 ,  H05K3/243 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09736 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A printed circuit board and a method of manufacturing the same are disclosed. The method of manufacturing a printed circuit board including a connecting layer configured to which is configured to electrically connect both sides of an insulator, and a pad part, electrically connect both sides of an insulator, and a pad part formed in one side of the insulator to be directly in contact with the connecting layer, includes: forming a seed layer part on one side of the insulator, a portion of the seed layer part being bulged, forming a via hole by processing the other side of the insulator, corresponding to the bulged portion of the seed layer part, forming the connecting layer inside the via hole, and forming a plating layer, corresponding to the pad part, on the seed layer part. A pattern having a finer pitch, maintaining a VOP structure, can be formed and a lower side of a substrate is not penetrated through when a via hole is processed.

    摘要翻译： 公开了一种印刷电路板及其制造方法。 制造印刷电路板的方法包括：被配置为电连接绝缘体的两侧的连接层和电连接绝缘体的两侧的焊盘部分和形成在绝缘体的一侧的焊盘部分的连接层 与连接层直接接触的方法包括：在绝缘体的一侧形成种子层部分，种子层部分的一部分被凸起，通过加工绝缘体的另一侧形成通孔，对应于 种子层部分的隆起部分，在通孔内形成连接层，并在种子层部分上形成对应于焊盘部分的镀层。 当形成通孔时，可以形成具有更细的间距，保持VOP结构的图案，并且当基板的下侧不被穿透时。