发明授权
- 专利标题： Triple-axis MEMS accelerometer having a bottom capacitor
- 专利标题（中）： 具有底部电容器的三轴MEMS加速度计
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申请号： US12751633申请日： 2010-03-31
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公开(公告)号： US08106470B2公开(公告)日： 2012-01-31
- 发明人: Ting-Hau Wu , Chun-Wen Cheng , Chun-Ren Cheng , Shang-Ying Tsai , Jung-Huei Peng , Jiou-Kang Lee , Allen Timothy Chang
- 申请人： Ting-Hau Wu , Chun-Wen Cheng , Chun-Ren Cheng , Shang-Ying Tsai , Jung-Huei Peng , Jiou-Kang Lee , Allen Timothy Chang
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/32
- IPC分类号： H01L21/32
摘要：
An integrated circuit structure includes a substrate having a top surface; a first conductive layer over and contacting the top surface of the substrate; a dielectric layer over and contacting the first conductive layer, wherein the dielectric layer includes an opening exposing a portion of the first conductive layer; and a proof-mass in the opening and including a second conductive layer at a bottom of the proof-mass. The second conductive layer is spaced apart from the portion of the first conductive layer by an air space. Springs anchor the proof-mass to portions of the dielectric layer encircling the opening. The springs are configured to allow the proof-mass to make three-dimensional movements.
公开/授权文献
- US20100308424A1 Triple-Axis MEMS Accelerometer Having a Bottom Capacitor 公开/授权日：2010-12-09
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