Invention Grant
- Patent Title: Integrating capacitors into vias of printed circuit boards
- Patent Title (中): 将电容器集成到印刷电路板的通孔中
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Application No.: US12274407Application Date: 2008-11-20
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Publication No.: US08107254B2Publication Date: 2012-01-31
- Inventor: Justin P. Bandholz , Jonathan R. Hinkle , Pravin Patel
- Applicant: Justin P. Bandholz , Jonathan R. Hinkle , Pravin Patel
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Biggers & Ohanian, LLP
- Agent Brandon C. Kennedy; Cynthia G. Seal
- Main IPC: H05K3/00
- IPC: H05K3/00

Abstract:
A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hole characterized by a generally tubular inner surface; a capacitor integrated within the via, the capacitor including two capacitor plates, an inner plate and an outer plate, the two plates composed of electrically conductive material disposed upon the inner surface of the via hole, both plates traversing layers of the laminate, the inner plate traversing more layers of the laminate than are traversed by the outer plate; and a layer of dielectric material disposed between the two plates.
Public/Granted literature
- US20100124035A1 Integrating Capacitors Into Vias Of Printed Circuit Boards Public/Granted day:2010-05-20
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