发明授权
- 专利标题: Defect inspection method and apparatus
- 专利标题(中): 缺陷检查方法和装置
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申请号: US13072102申请日: 2011-03-25
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公开(公告)号: US08107717B2公开(公告)日: 2012-01-31
- 发明人: Shunji Maeda , Kenji Oka , Yukihiro Shibata , Minoru Yoshida , Chie Shishido , Yuji Takagi , Atsushi Yoshida , Kazuo Yamaguchi
- 申请人: Shunji Maeda , Kenji Oka , Yukihiro Shibata , Minoru Yoshida , Chie Shishido , Yuji Takagi , Atsushi Yoshida , Kazuo Yamaguchi
- 申请人地址: JP Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP10-110383 19980421; JP10-264275 19980918
- 主分类号: G06K9/00
- IPC分类号: G06K9/00
摘要:
Arrangements for inspecting a specimen on which plural patterns are formed; capturing a first image of a first area; capturing a second image of a second area in which patterns which are essentially the same with the patterns formed in the first area; creating data relating to corresponding pixels of the first and second images, for each pixel; determining a threshold for each pixel for detecting defects directly in accordance with the first and second images; and detecting defects on the specimen by processing the first and second images by using the threshold for each pixel and information of a scattered diagram of brightness of the first and second images, wherein the threshold is determined by using information of brightness of a local region of at least one of the first and second images, with the local region including an aimed pixel and peripheral pixels of the aimed pixel.
公开/授权文献
- US20110170765A1 DEFECT INSPECTION METHOD AND APPARATUS 公开/授权日:2011-07-14
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