发明授权
- 专利标题: Imprint device and microstructure transfer method
- 专利标题(中): 压印装置和微结构转印方法
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申请号: US11774244申请日: 2007-07-06
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公开(公告)号: US08109751B2公开(公告)日: 2012-02-07
- 发明人: Takashi Ando , Susumu Komoriya , Masahiko Ogino , Akihiro Miyauchi
- 申请人: Takashi Ando , Susumu Komoriya , Masahiko Ogino , Akihiro Miyauchi
- 申请人地址: JP Tokyo
- 专利权人: Hitachi High-Technologies Corporation
- 当前专利权人: Hitachi High-Technologies Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2006-187958 20060707
- 主分类号: B28B11/08
- IPC分类号: B28B11/08
摘要:
There is provided an imprint device for transferring a fine pattern to a material to form a patterned material. The device comprises a stamper having the fine pattern thereon, and a pressure distribution mechanism. The stamper is pressed against the material, and the pressure distribution mechanism provides a nonuniform pressure distribution in a patterned region of the patterned material, while the stamper is in contact with the material. There are provided an imprint device and a microstructure transfer method, by which it is possible to sufficiently spread a resin or other material for forming a pattern layer between a stamper and a patterned material with a lower pressure so as not to damage the stamper or the patterned material, and to form a pattern formation layer having the uniform thickness on the patterned material.
公开/授权文献
- US20080042319A1 IMPRINT DEVICE AND MICROSTRUCTURE TRANSFER METHOD 公开/授权日:2008-02-21