Invention Grant
- Patent Title: Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
- Patent Title (中): 通过在相邻的半导体封装之间延伸的电连接器堆叠和互连半导体封装的方法
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Application No.: US12614998Application Date: 2009-11-09
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Publication No.: US08110439B2Publication Date: 2012-02-07
- Inventor: Cheeman Yu , Chi-Chin Liao , Hem Takiar
- Applicant: Cheeman Yu , Chi-Chin Liao , Hem Takiar
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus & DeNiro LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/30
Abstract:
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.
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