发明授权
- 专利标题： Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
- 专利标题（中）： 通过在相邻的半导体封装之间延伸的电连接器堆叠和互连半导体封装的方法
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申请号： US12614998申请日： 2009-11-09
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公开(公告)号： US08110439B2公开(公告)日： 2012-02-07
- 发明人: Cheeman Yu , Chi-Chin Liao , Hem Takiar
- 申请人： Cheeman Yu , Chi-Chin Liao , Hem Takiar
- 申请人地址： US TX Plano
- 专利权人： SanDisk Technologies Inc.
- 当前专利权人： SanDisk Technologies Inc.
- 当前专利权人地址： US TX Plano
- 代理机构： Vierra Magen Marcus & DeNiro LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/30
摘要：
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.
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