发明授权
- 专利标题： In-package microelectronic apparatus, and methods of using same
- 专利标题（中）： 包装内微电子装置及其使用方法
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申请号： US12455762申请日： 2009-06-05
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公开(公告)号： US08110920B2公开(公告)日： 2012-02-07
- 发明人: Sriram Dattaguru , Lesley A. Polka Wood , Yoshihiro Tomita , Kinya Ichikawa , Robert L. Sankman
- 申请人： Sriram Dattaguru , Lesley A. Polka Wood , Yoshihiro Tomita , Kinya Ichikawa , Robert L. Sankman
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理商 John N. Greaves
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H05K1/16
摘要：
A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s.
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