发明授权
US08110922B2 Wafer level semiconductor module and method for manufacturing the same 有权
晶圆级半导体模块及其制造方法

Wafer level semiconductor module and method for manufacturing the same
摘要:
A wafer level semiconductor module may include a module board and an IC chip set mounted on the module board. The IC chip set may include a plurality of IC chips having scribe lines areas between the adjacent IC chips. Each IC chip may have a semiconductor substrate having an active surface with a plurality of chip pads and a back surface. A passivation layer may be provided on the active surface of the semiconductor substrate of each IC chip and may having openings through which the chip pads may be exposed. Sealing portions may be formed in scribe line areas.
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