Invention Grant
- Patent Title: Chip resistor and method for manufacturing the same
- Patent Title (中): 贴片电阻及其制造方法
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Application No.: US12465226Application Date: 2009-05-13
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Publication No.: US08111130B2Publication Date: 2012-02-07
- Inventor: Torayuki Tsukada
- Applicant: Torayuki Tsukada
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2008-126942 20080514; JP2008-209615 20080818
- Main IPC: H01C1/142
- IPC: H01C1/142
Abstract:
A chip resistor includes a resistor element, a reinforcing member, and a pair of electrodes. The resistor element includes a first surface and a second surface opposite to the first surface. The reinforcing member is bonded to the first surface of the resistor element. The pair of electrodes are formed on the second surface of the resistor element. The resistor element is formed with a slit located between the pair of electrodes.
Public/Granted literature
- US20090284342A1 CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-11-19
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