In one embodiment, a structure includes a semiconductor chip including a communication element for performing a wireless communication function where the communication element has a communication core occupying a region of the semiconductor chip, a plurality of chip pads with two of the chip pads electrically connected to the communication core; a chip carrier for carrying the semiconductor chip where the chip carrier includes a plurality of carrier pads with two of the carrier pads connected to the two chip pads; and an antenna connected to the carrier pads and electrically connected to the chip pads and to the communication core.