发明授权
- 专利标题： Method of manufacturing substrate for liquid discharge head
- 专利标题（中）： 液体排出头用基板的制造方法
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申请号： US12203651申请日： 2008-09-03
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公开(公告)号： US08114305B2公开(公告)日： 2012-02-14
- 发明人: Hiroto Komiyama , Hirokazu Komuro , Satoshi Ibe , Takuya Hatsui , Keisuke Kishimoto , Kazuhiro Asai , Shimpei Otaka
- 申请人： Hiroto Komiyama , Hirokazu Komuro , Satoshi Ibe , Takuya Hatsui , Keisuke Kishimoto , Kazuhiro Asai , Shimpei Otaka
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitzpatrick, Cella, Harper & Scinto
- 优先权： JP2007-231336 20070906
- 主分类号： G01D15/00
- IPC分类号： G01D15/00 ; G11B5/127
摘要：
A method of manufacturing a silicon substrate for a liquid discharge head with a liquid supply opening formed therein includes: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.
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