Invention Grant
US08114522B2 Resin composition, laminate using the same, and molded body using the laminate
失效
树脂组合物,使用其的层压体,以及使用层压体的成型体
- Patent Title: Resin composition, laminate using the same, and molded body using the laminate
- Patent Title (中): 树脂组合物,使用其的层压体,以及使用层压体的成型体
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Application No.: US12811857Application Date: 2009-02-16
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Publication No.: US08114522B2Publication Date: 2012-02-14
- Inventor: Yuji Kitora , Mitsuhiro Kawahara , Kazue Ueda
- Applicant: Yuji Kitora , Mitsuhiro Kawahara , Kazue Ueda
- Applicant Address: JP Hyogo
- Assignee: Unitika Ltd.
- Current Assignee: Unitika Ltd.
- Current Assignee Address: JP Hyogo
- Agency: Fildes & Outland, P.C.
- Priority: JP2008-038796 20080220; JP2008-038797 20080220
- International Application: PCT/JP2009/000585 WO 20090216
- International Announcement: WO2009/104372 WO 20090827
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B27/30 ; B32B27/32 ; B32B27/36

Abstract:
Disclosed is a resin composition forming an adhesive layer between a polylactic acid resin substrate layer and a polyolefin resin substrate layer. The resin composition includes a modified polyolefin resin (A) and a terpene resin (B), and the mass ratio (A)/(B) between the both resins (A) and (B) is 20/80 to 99/1. Alternatively, the resin composition may be a resin composition including 10 to 90% by mass of a polylactic acid resin (C), 5 to 89% by mass of the modified polyolefin resin (A) and 1 to 80% by mass of a hydrogenated petroleum resin (D), with the total amount of these resins constrained to be 100% by mass.
Public/Granted literature
- US20100279135A1 RESIN COMPOSITION, LAMINATE USING THE SAME, AND MOLDED BODY USING THE LAMINATE Public/Granted day:2010-11-04
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