发明授权
- 专利标题: Process chamber component having electroplated yttrium containing coating
- 专利标题(中): 处理室组件具有电镀含钇的涂层
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申请号: US12151842申请日: 2008-05-08
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公开(公告)号: US08114525B2公开(公告)日: 2012-02-14
- 发明人: Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
- 申请人: Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Janah & Associates, P.C.
- 代理商 Ashok K. Janah
- 主分类号: B32B15/04
- IPC分类号: B32B15/04 ; B32B15/20 ; B01J19/02 ; B05C11/00
摘要:
A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include zirconium oxide, or can have an oxide layer thereon. In another embodiment the electroplated coating comprises a first species and is coated with a second electroplated coating comprising a second species that is different from the first species. The electroplated coating is resistant to corrosion in the plasma. In another embodiment, the electroplated coating has an interface having a thickness with a first concentration gradient of an yttrium-containing species and a second concentration gradient of a second species. An electroplated coating having a layer comprising first and second concentration gradients of first and second metals can be formed by varying the concentration of the first and second metal electrolyte species in the electroplating bath to electroplate the coating.
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