发明授权
- 专利标题： Lead frame for semiconductor device
- 专利标题（中）： 半导体器件引线框架
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申请号： US13021716申请日： 2011-02-05
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公开(公告)号： US08115288B2公开(公告)日： 2012-02-14
- 发明人: Yongsheng Lu , Bin Tian , Nan Xu , Jinzhong Yao , Shufeng Zhao
- 申请人： Yongsheng Lu , Bin Tian , Nan Xu , Jinzhong Yao , Shufeng Zhao
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 优先权： CN201010147513 20100409
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/495
摘要：
A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame.
公开/授权文献
- US20110248393A1 LEAD FRAME FOR SEMICONDUCTOR DEVICE 公开/授权日：2011-10-13
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