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    Crystal form I of (S)-4-hydroxy-2-oxo-1-pyrrolidine acetamide, preparing method and use thereof
    1.
    发明授权
    Crystal form I of (S)-4-hydroxy-2-oxo-1-pyrrolidine acetamide, preparing method and use thereof 有权
    （S）-4-羟基-2-氧代-1-吡咯烷乙酰胺的晶型I的制备方法和用途

    公开(公告)号：US09238622B2

    公开(公告)日：2016-01-19

    申请号：US13581821

    申请日：2010-09-08

    申请人： Chao You ,  Hua Feng ,  Qi Pang ,  Lei Ye ,  Yuying Chen ,  Zuyuan Rong ,  Lei Jin ,  Nan Xu ,  Fei Li ,  Bo Li

    发明人： Chao You ,  Hua Feng ,  Qi Pang ,  Lei Ye ,  Yuying Chen ,  Zuyuan Rong ,  Lei Jin ,  Nan Xu ,  Fei Li ,  Bo Li

    IPC分类号： C07D207/273

    CPC分类号： C07D207/273

    摘要： A crystal form I of (S)-4-hydroxy-2-oxo-1-pyrrolidine acetamide, or named (S)-oxiracetam, is provided, which is characterized by a powder x-ray diffraction pattern that exhibits data of d-values versus the relative intensities as: 7.075(M), 5.355(S), 5.092(S), 4.590(M), 4.325(M), 4.259(S), 4.041(VS), 3.808(M), 3.542(M), 3.445(M), 3.393(M), 2.972(M), 2.914(S). A method for preparing a crystal form I of (S)-oxiracetam is also provided, which includes preparing the crude product and crystallizing A use of the crystal form I of (S)-oxiracetam in the manufacture of a medicament for preventing and treating memory dysfunction is also provided. Accordingly, the crystal form I of (S)-oxiracetam prepared by the method has high purity of more than 99.3% based on the percentages of the mass, with better efficacy than (S)-oxiracetam for preventing or treating memory dysfunction. Concerning the way of charging materials, adding inorganic base only a few times is simpler and more beneficial to industrial manufacturing and application.

    摘要翻译： 提供（S）-4-羟基-2-氧代-1-吡咯烷乙酰胺的结晶形式I，或称为（S） - 氧西拉坦，其特征在于粉末x射线衍射图，其显示d- 值相对于7.075（M），5.355（S），5.092（S），4.590（M），4.325（M），4.259（S），4.041（VS），3.808（M） ），3.445（M），3.393（M），2.972（M），2.914（S）。 还提供了制备（S） - 氧西拉坦的晶形I的方法，其包括制备粗产物并结晶A（S） - 氧西拉坦的晶型I的用途在制备用于预防和治疗记忆的药物中 还提供功能障碍。 因此，通过该方法制备的（S） - 氧乙酰胺的晶型I基于质量百分比具有高于99.3％的高纯度，与用于预防或治疗记忆功能障碍的（S） - 奥昔西坦相比，具有更好的功效。 关于充电材料的方法，仅添加无机碱几次更简单，更有利于工业制造和应用。

    METHOD FOR MAKING SEMICONDUCTOR PACKAGE
    4.
    发明申请
    METHOD FOR MAKING SEMICONDUCTOR PACKAGE 有权
    制造半导体封装的方法

    公开(公告)号：US20110193237A1

    公开(公告)日：2011-08-11

    申请号：US13004029

    申请日：2011-01-11

    申请人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

    发明人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

    IPC分类号： H01L23/48 ,  H01L21/56

    CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented.

    摘要翻译： 一种组装半导体封装的方法包括在封装材料的后模塑固化之后的快速冷却步骤。 快速冷却步骤包括将冷却的压缩空气吹在包装上约两分钟。 快速冷却步骤不需要同时对包装施加任何夹紧压力。 快速冷却步骤将封装材料的温度从低于5分钟的最长时间内将固化温度降低到冷却温度。 通过使用快速冷却，与在环境空气下的夹紧压力下冷却封装相反，防止由于CTE错配引起的封装翘曲。

    SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR INTEGRATED CIRCUIT
    7.
    发明申请
    SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR INTEGRATED CIRCUIT 有权
    半导体集成电路封装及封装半导体集成电路的方法

    公开(公告)号：US20090236713A1

    公开(公告)日：2009-09-24

    申请号：US12403400

    申请日：2009-03-13

    申请人： Xuesong XU ,  Nan XU ,  Jinzhong YAO

    发明人： Xuesong XU ,  Nan XU ,  Jinzhong YAO

    IPC分类号： H01L23/495 ,  H01L21/60 ,  H01L21/56 ,  B29C45/14

    CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed. After curing the mold compound, removing the mold and de-taping, the mold compound filled in the clearances is recessed inward from the back surface, which increases the solderability in the subsequent surface mount process and decreases the possibility of the occurrence of lead short-circuits.

    摘要翻译： 在封装半导体IC的方法中，将带附接到引线框架阵列的后表面，并且引线框架阵列保持在模具的上模追逐和下模追逐之间，其中 引线框阵列向上。 上下模具分别相对于引线框架阵列形成上腔体和下腔体。 模具化合物分别注入上腔和下穴。 关于引线之间，芯片之间和/或引线和芯片焊盘之间的间隙，注入上腔的模具复合体在注入到下腔内的模具化合物填充间隙之前在间隙上覆盖磁带的部分 ，使得磁带被压下。 在固化模具化合物之后，除去模具和脱胶，填充间隙的模具化合物从后表面向内凹入，这增加了随后的表面贴装工艺中的可焊性，并且降低了引线短路的可能性， 电路。

    METHOD AND MEMBER FOR MEASURING STRESS DISTRIBUTION OF NATURAL BONE, SYNTHETIC BONE, OR MEMBER ATTACHED TO THEM
    8.
    发明申请
    METHOD AND MEMBER FOR MEASURING STRESS DISTRIBUTION OF NATURAL BONE, SYNTHETIC BONE, OR MEMBER ATTACHED TO THEM 有权
    用于测量自然骨，合成骨或与其结合的成员的应力分布的方法和成员

    公开(公告)号：US20090012431A1

    公开(公告)日：2009-01-08

    申请号：US11814450

    申请日：2006-01-11

    申请人： Koji Hyodo ,  Chao-Nan Xu

    发明人： Koji Hyodo ,  Chao-Nan Xu

    IPC分类号： A61B5/103 ,  A61B19/00 ,  A61H33/00

    CPC分类号： A61F2/4657 ,  A61B5/4504 ,  A61B5/4528 ,  A61F2/36 ,  A61F2/3662 ,  A61F2002/3631 ,  A61F2002/4632 ,  A61F2002/4666 ,  G01L1/241 ,  G09B23/30 ,  G09B23/32

    摘要： When visualizing the stress distribution of natural bone, synthetic bone, or a member attached to either thereof without omitted points, in order to measure accurately in a variety of modes using an inexpensive system, a mechanoluminescence material thin film 6 is formed in advance on a bone material peripheral surface 5 in an appropriate area thereof including the portion where an insertion support portion 4 of an artificial hip prosthesis 2 is inserted into a hollow inside 3 of a damaged femur 1 or a synthetic bone simulating the damaged femur. The mechanoluminescence material thin film 6 portion is photographed over its entire circumference with an IICCD camera 7 from the external peripheral side thereof as or after the artificial hip prosthesis 2 is inserted. The obtained image is fed to a computer 11 to obtain a luminescence image 8. The computer 11 outputs the intensities of the received light in the form of an image as is, so that the luminescence image 8 can be obtained easily. Particularly, the data about the intensities of the received light can be used as stress/strain data virtually as is. Such method is also suitable for dynamic analysis.

    摘要翻译： 当可视化天然骨骼，合成骨骼或附着于其中的部件的应力分布而不省略时，为了使用廉价的系统以各种模式精确地测量，机械发光材料薄膜6预先形成在 骨材料周边表面5在其适当的区域中，包括将人造髋假体2的插入支撑部分4插入损伤股骨1的中空内侧3中的部分或模拟受损股骨的合成骨。 机械发光材料薄膜6部分在其人造髋假体2插入之后或之后，利用来自其外周侧的IICCD照相机7在其整个圆周上进行拍照。 所获得的图像被馈送到计算机11以获得发光图像8.计算机11原样输出图像形式的接收光的强度，使得可以容易地获得发光图像8。 特别地，关于接收光的强度的数据可以被虚拟地用作应力/应变数据。 这种方法也适用于动态分析。

    Stress-induced light emitting composite material transparent in visible light range, water-resistive stress-induced light emitting inorganic particles, production methods thereof and use thereof
    9.
    发明申请
    Stress-induced light emitting composite material transparent in visible light range, water-resistive stress-induced light emitting inorganic particles, production methods thereof and use thereof 审中-公开
    应力诱发发光复合材料在可见光范围内透明，耐水应力诱发发光无机颗粒，其制备方法和用途

    公开(公告)号：US20050266269A1

    公开(公告)日：2005-12-01

    申请号：US11122554

    申请日：2005-05-04

    申请人： Yusuke Imai ,  Chao-Nan Xu

    发明人： Yusuke Imai ,  Chao-Nan Xu

    IPC分类号： C09K11/08 ,  B32B9/00 ,  C08K3/00 ,  C08K9/00 ,  C08L101/00 ,  C09D5/22 ,  C09D7/12 ,  C09D201/00

    CPC分类号： C08K3/01

    摘要： A stress-induced light emitting composite material according to the present invention contains at least stress-induced light emitting inorganic particles, which emit light at application of a mechanical effect thereon and a polymer material. The stress-induced light emitting inorganic particles are not more than a wavelength of visible light in particle diameter and surface-treated. With this arrangement, the stress-induced light emitting composite material becomes transparent in a visible light range. Moreover the surface treatment of the stress-induced light emitting inorganic particles give water resistance to the stress-induced light emitting inorganic particles.

    摘要翻译： 根据本发明的应力诱发发光复合材料至少包含在其上施加机械效应时发光的应力诱发发光无机颗粒和聚合物材料。 应力诱发的发光无机粒子的粒径不大于可见光的波长，经表面处理。 通过这种布置，应力诱发的发光复合材料在可见光范围内变得透明。 此外，应力诱导的发光无机颗粒的表面处理对应力诱发的发光无机颗粒产生耐水性。

    Mechanoluminescence material and process for producing the same
    10.
    发明申请
    Mechanoluminescence material and process for producing the same 失效
    机械发光材料及其制造方法

    公开(公告)号：US20050247912A1

    公开(公告)日：2005-11-10

    申请号：US10519937

    申请日：2003-07-24

    申请人： Morito Akiyama ,  Chao-Nan Xu ,  Kazuhiro Nonaka

    发明人： Morito Akiyama ,  Chao-Nan Xu ,  Kazuhiro Nonaka

    IPC分类号： C09K11/64 ,  C09K11/08 ,  C09K11/77 ,  C09K11/80

    CPC分类号： C09K11/7734 ,  C09K11/7792 ,  F21K2/04

    摘要： A mechanoluminescence material comprising a matrix of composite metal oxide containing strontium and aluminum, represented by the general formula SrM1Al6O11 (wherein M1 is an alkaline earth metal) or SrM2Al3O7 (wherein M2 is a rare earth metal), and further comprising, as luminescence centers, a metal selected from among rare earth metals and transition metals capable of emitting light when a carrier having been excited by mechanical energy returns to its ground state.

    摘要翻译： 一种机械发光材料，其包含由通式SrM 1 Al 6 O 11表示的含有锶和铝的复合金属氧化物的基质（其中M 1是一种碱土金属）或SrM 2 O 3 N 7 O 7（其中M < / SUP>是稀土金属），并且还包含作为发光中心的金属，当通过机械能激发的载体返回到其基态时，能够发光的稀土金属和过渡金属中的金属。