发明授权
- 专利标题： Semiconductor package and method of manufacturing the semiconductor package
- 专利标题（中）： 半导体封装及半导体封装的制造方法
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申请号： US12110222申请日： 2008-04-25
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公开(公告)号： US08115323B2公开(公告)日： 2012-02-14
- 发明人: Wha-Su Sin , Heui-Seog Kim , Jong-Keun Jeon
- 申请人： Wha-Su Sin , Heui-Seog Kim , Jong-Keun Jeon
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2007-0041923 20070430
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/29
摘要：
A semiconductor package and a method of manufacturing the package are provided. The semiconductor package comprises: a mounting substrate including a bond finger; at least one semiconductor chip disposed on the mounting substrate, the semiconductor chip including a bonding pad; a first molding member disposed on the mounting substrate so as to cover the bond finger and the bonding pad, the first molding member including an interconnection path disposed inside the first molding member so as to connect the bond finger to the bonding pad; a conductive element disposed in the interconnection path; and a second molding member overlying the first molding member. The interconnection path can be formed by a laser process. The conductive element can be formed by conductive nanoparticles or metal wires.
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