公开(公告)号：US07452753B2

公开(公告)日：2008-11-18

申请号：US11172689

申请日：2005-06-30

申请人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

发明人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368

摘要： A method of processing a semiconductor wafer that has a first surface and a second surface opposite to the first surface. The method includes forming grooves of a predetermined depth on the second surface on which circuit patterns are formed, attaching a first surface of a protective tape to the second surface on which the grooves are formed, attaching a carrier tape to a second surface of the protective tape opposite to the first surface of the protective tape so that the first surface of the semiconductor wafer can be oriented upward, removing the first surface of the semiconductor wafer by a predetermined thickness and dividing the semiconductor wafer into chips by the grooves, and supplying each chip to a die bonder in the state where the first surface of the of the chip is oriented upward. Only one kind of die bonder is needed. A UV-type tape is not required.

摘要翻译： 一种处理具有与第一表面相对的第一表面和第二表面的半导体晶片的方法。 该方法包括在其上形成有电路图案的第二表面上形成预定深度的凹槽，将保护带的第一表面附接到其上形成有凹槽的第二表面，将载带附着到保护层的第二表面上 带，使得半导体晶片的第一表面可以向上取向，将半导体晶片的第一表面除去预定的厚度，并通过凹槽将半导体晶片分成芯片，并将每个 在芯片的第一表面朝向上方的状态下的芯片接合器。 只需要一种管芯焊接机。 不需要UV型胶带。

公开(公告)号：US20080251949A1

公开(公告)日：2008-10-16

申请号：US12078801

申请日：2008-04-04

申请人： Wha-Su Sin ,  Heui-Seog Kim ,  Jong-Keun Jeon

发明人： Wha-Su Sin ,  Heui-Seog Kim ,  Jong-Keun Jeon

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L21/566 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Example embodiments include molding apparatuses, semiconductor packages, a fabricating methods for fabricating the same. The molding apparatus may include a first mold die for adhering a partially completed package, a second mold die including a cavity formed such that the partially completed package is positioned inside the cavity and a molding resin for encapsulating the partially completed package inserted into the cavity, and a multi-layered film supply unit for supplying a multi-layered film to the cavity of the second mold die. The semiconductor package may include a substrate, a semiconductor chip electrically connected to the substrate, a molding resin for encapsulating the semiconductor chip and an electrical portion of the substrate, and a marking film, adhered to an outer surface of the molding resin such that a mark is marked in the marking film.

摘要翻译： 示例性实施例包括模制设备，半导体封装，其制造方法。 模制装置可以包括用于粘附部分完成的包装的第一模具模具，包括形成为使得部分完成的包装件位于空腔内部的空腔的第二模具模具和用于封装插入到模腔中的部分完成的包装的模制树脂， 以及用于将多层膜供应到第二模具模具的空腔的多层膜供给单元。 半导体封装可以包括基板，与基板电连接的半导体芯片，用于封装半导体芯片的模制树脂和基板的电气部分，以及附着到模制树脂的外表面上的标记膜，使得 标记被标记在标记胶片中。

公开(公告)号：US07420814B2

公开(公告)日：2008-09-02

申请号：US11100525

申请日：2005-04-07

申请人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

发明人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

IPC分类号： H05K1/14

CPC分类号： H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/3511

摘要： A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may include a second IC chip with an active surface and a back surface. The back surface of the second IC chip may be attached to a first major surface of a second circuit substrate and the active surface of the second IC chip may be electrically connected to the first major surface of the second circuit substrate. The first package may be stacked on the second package so that the active surface of the second package may be electrically connected to a second major surface of the first circuit substrate of the first package. A method may involve providing a first package having a first IC chip and a first circuit substrate and providing a second package having a second IC chip and a second circuit substrate. The first and the second packages may be stacked so that the active surface of the second IC may face and be electrically connected to a major surface of the first circuit substrate.

摘要翻译： 包装堆叠可以包括第一包装和第二包装。 第一封装可以具有带有活性表面和背面的IC芯片。 有源表面可以连接到第一电路基板的第一主表面。 第二封装可以包括具有有源表面和后表面的第二IC芯片。 第二IC芯片的背面可以附接到第二电路基板的第一主表面，并且第二IC芯片的有源表面可以电连接到第二电路基板的第一主表面。 第一封装可以堆叠在第二封装上，使得第二封装的有源表面可以电连接到第一封装的第一电路基板的第二主表面。 一种方法可以包括提供具有第一IC芯片和第一电路基板的第一封装，并提供具有第二IC芯片和第二电路基板的第二封装。 可以堆叠第一和第二封装，使得第二IC的有源表面可以面对并且电连接到第一电路基板的主表面。

公开(公告)号：US20060057833A1

公开(公告)日：2006-03-16

申请号：US11070212

申请日：2005-03-03

申请人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

发明人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

IPC分类号： H01L21/44

CPC分类号： H01L23/3128 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3484 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/0401

摘要： A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bumps are embedded.

摘要翻译： 形成焊球的方法可以包括通过在电路基板的焊盘图案上的导线形成来形成凸块。 焊膏可以通过丝网印刷施加到凸块上。 焊膏可以通过回流熔化以形成其中嵌入凸块的焊球。

公开(公告)号：US07427558B2

公开(公告)日：2008-09-23

申请号：US11070212

申请日：2005-03-03

申请人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

发明人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

IPC分类号： H01L21/44

CPC分类号： H01L23/3128 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3484 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/0401

摘要： A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bumps are embedded.

摘要翻译： 形成焊球的方法可以包括通过在电路基板的焊盘图案上的导线形成来形成凸块。 焊膏可以通过丝网印刷施加到凸块上。 焊膏可以通过回流熔化以形成其中嵌入凸块的焊球。

公开(公告)号：US20060003491A1

公开(公告)日：2006-01-05

申请号：US11153750

申请日：2005-06-14

申请人： Goon-Woo Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin ,  Jong-Ung Lee

发明人： Goon-Woo Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin ,  Jong-Ung Lee

IPC分类号： H01L21/44

CPC分类号： H01L21/67132

摘要： An apparatus and method for ejecting a thin IC chip from a UV-sensitive tape attached to a bottom face of a semiconductor wafer, includes a vacuum holder that partly supports the UV-sensitive tape by applying vacuum force. The apparatus further includes an ejecting block inserted in the vacuum holder and configured to move vertically relative to the vacuum holder, and a plurality of ejecting pins inserted in the ejecting block and configured to move vertically and elastically. The ejecting pins move upward from the ejecting block driven by a pin-driving plate, detaching the IC chip from the UV-sensitive tape. Then the ejecting block moves upward from the vacuum holder driven by a block-driving shaft, applying a pressure to the bottom face of the IC chip.

摘要翻译： 从安装在半导体晶片底面的紫外线敏感胶带排出薄IC芯片的装置和方法包括通过施加真空力部分地支撑UV敏感胶带的真空支架。 所述装置还包括插入所述真空保持器中并被配置为相对于所述真空保持件垂直移动的排出块，以及插入所述排出块中并被构造成垂直和弹性移动的多个排出销。 排出销从由销驱动板驱动的排出块向上移动，将IC芯片从紫外线敏感胶带分离。 然后，排出块从由块驱动轴驱动的真空保持器向上移动，向IC芯片的底面施加压力。

公开(公告)号：US08115323B2

公开(公告)日：2012-02-14

申请号：US12110222

申请日：2008-04-25

申请人： Wha-Su Sin ,  Heui-Seog Kim ,  Jong-Keun Jeon

发明人： Wha-Su Sin ,  Heui-Seog Kim ,  Jong-Keun Jeon

IPC分类号： H01L23/48 ,  H01L23/29

CPC分类号： H01L24/82 ,  H01L24/24 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/83801 ,  H01L2224/92244 ,  H01L2225/0651 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor package and a method of manufacturing the package are provided. The semiconductor package comprises: a mounting substrate including a bond finger; at least one semiconductor chip disposed on the mounting substrate, the semiconductor chip including a bonding pad; a first molding member disposed on the mounting substrate so as to cover the bond finger and the bonding pad, the first molding member including an interconnection path disposed inside the first molding member so as to connect the bond finger to the bonding pad; a conductive element disposed in the interconnection path; and a second molding member overlying the first molding member. The interconnection path can be formed by a laser process. The conductive element can be formed by conductive nanoparticles or metal wires.

摘要翻译： 提供半导体封装和制造封装的方法。 半导体封装包括：安装基板，包括粘结指状物; 设置在所述安装基板上的至少一个半导体芯片，所述半导体芯片包括焊盘; 第一成型构件，其设置在所述安装基板上以覆盖所述粘结指状物和所述接合焊盘，所述第一模制构件包括布置在所述第一模制构件内部的互连路径，以将所述粘结指状物连接到所述焊盘; 布置在所述互连路径中的导电元件; 以及覆盖所述第一模制构件的第二模制构件。 互连路径可以通过激光工艺形成。 导电元件可以由导电纳米颗粒或金属线形成。

公开(公告)号：US20080265431A1

公开(公告)日：2008-10-30

申请号：US12110222

申请日：2008-04-25

申请人： Wha-Su Sin ,  Heui-Seog Kim ,  Jong-Keun Jeon

发明人： Wha-Su Sin ,  Heui-Seog Kim ,  Jong-Keun Jeon

IPC分类号： H01L23/49

CPC分类号： H01L24/82 ,  H01L24/24 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/83801 ,  H01L2224/92244 ,  H01L2225/0651 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor package and a method of manufacturing the package are provided. The semiconductor package comprises: a mounting substrate including a bond finger; at least one semiconductor chip disposed on the mounting substrate, the semiconductor chip including a bonding pad; a first molding member disposed on the mounting substrate so as to cover the bond finger and the bonding pad, the first molding member including an interconnection path disposed inside the first molding member so as to connect the bond finger to the bonding pad; a conductive element disposed in the interconnection path; and a second molding member overlying the first molding member. The interconnection path can be formed by a laser process. The conductive element can be formed by conductive nanoparticles or metal wires.

摘要翻译： 提供半导体封装和制造封装的方法。 半导体封装包括：安装基板，包括粘结指状物; 设置在所述安装基板上的至少一个半导体芯片，所述半导体芯片包括焊盘; 第一成型构件，其设置在所述安装基板上以覆盖所述粘结指状物和所述接合焊盘，所述第一模制构件包括布置在所述第一模制构件内部的互连路径，以将所述粘结指状物连接到所述焊盘; 布置在所述互连路径中的导电元件; 以及覆盖所述第一模制构件的第二模制构件。 互连路径可以通过激光工艺形成。 导电元件可以由导电纳米颗粒或金属线形成。

公开(公告)号：US20060076665A1

公开(公告)日：2006-04-13

申请号：US11100525

申请日：2005-04-07

申请人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

发明人： Jae-Hong Kim ,  Heui-Seog Kim ,  Wha-Su Sin ,  Jong-Keun Jeon

IPC分类号： H05K1/14

CPC分类号： H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/3511

摘要： A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may include a second IC chip with an active surface and a back surface. The back surface of the second IC chip may be attached to a first major surface of a second circuit substrate and the active surface of the second IC chip may be electrically connected to the first major surface of the second circuit substrate. The first package may be stacked on the second package so that the active surface of the second package may be electrically connected to a second major surface of the first circuit substrate of the first package. A method may involve providing a first package having a first IC chip and a first circuit substrate and providing a second package having a second IC chip and a second circuit substrate. The first and the second packages may be stacked so that the active surface of the second IC may face and be electrically connected to a major surface of the first circuit substrate.

摘要翻译： 包装堆叠可以包括第一包装和第二包装。 第一封装可以具有带有活性表面和背面的IC芯片。 有源表面可以连接到第一电路基板的第一主表面。 第二封装可以包括具有有源表面和后表面的第二IC芯片。 第二IC芯片的背面可以附接到第二电路基板的第一主表面，并且第二IC芯片的有源表面可以电连接到第二电路基板的第一主表面。 第一封装可以堆叠在第二封装上，使得第二封装的有源表面可以电连接到第一封装的第一电路基板的第二主表面。 一种方法可以包括提供具有第一IC芯片和第一电路基板的第一封装，并提供具有第二IC芯片和第二电路基板的第二封装。 可以堆叠第一和第二封装，使得第二IC的有源表面可以面对并且电连接到第一电路基板的主表面。

公开(公告)号：US20060008948A1

公开(公告)日：2006-01-12

申请号：US11172689

申请日：2005-06-30

申请人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

发明人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

IPC分类号： H01L21/44

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368

摘要： A method of processing a semiconductor wafer that has a first surface and a second surface opposite to the first surface. The method includes forming grooves of a predetermined depth on the second surface on which circuit patterns are formed, attaching a first surface of a protective tape to the second surface on which the grooves are formed, attaching a carrier tape to a second surface of the protective tape opposite to the first surface of the protective tape so that the first surface of the semiconductor wafer can be oriented upward, removing the first surface of the semiconductor wafer by a predetermined thickness and dividing the semiconductor wafer into chips by the grooves, and supplying each chip to a die bonder in the state where the first surface of the of the chip is oriented upward. Only one kind of die bonder is needed. A UV-type tape is not required.

摘要翻译： 一种处理具有与第一表面相对的第一表面和第二表面的半导体晶片的方法。 该方法包括在其上形成有电路图案的第二表面上形成预定深度的凹槽，将保护带的第一表面附接到其上形成有凹槽的第二表面，将载带附着到保护层的第二表面上 带，使得半导体晶片的第一表面可以向上取向，将半导体晶片的第一表面除去预定厚度，并通过凹槽将半导体晶片分成芯片，并且将每个 在芯片的第一表面朝向上方的状态下的芯片接合器。 只需要一种管芯焊接机。 不需要UV型胶带。