Invention Grant
US08116093B2 Printed circuit board and semiconductor module having the same 有权
印刷电路板和具有该印刷电路板的半导体模块

Printed circuit board and semiconductor module having the same
Abstract:
A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads.
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