Invention Grant
- Patent Title: Printed circuit board and semiconductor module having the same
- Patent Title (中): 印刷电路板和具有该印刷电路板的半导体模块
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Application No.: US12132309Application Date: 2008-06-03
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Publication No.: US08116093B2Publication Date: 2012-02-14
- Inventor: Kwang-Soo Park , Jong-Hoon Kim
- Applicant: Kwang-Soo Park , Jong-Hoon Kim
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co. Ltd.
- Current Assignee: Samsung Electronics Co. Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2007-0054252 20070604
- Main IPC: H05K7/12
- IPC: H05K7/12 ; H05K1/11

Abstract:
A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads.
Public/Granted literature
- US20080298034A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME Public/Granted day:2008-12-04
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