发明授权
- 专利标题: Method for determining cooling requirements of a computer system enclosure
- 专利标题(中): 确定计算机系统外壳的冷却要求的方法
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申请号: US12213146申请日: 2008-06-16
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公开(公告)号: US08117012B2公开(公告)日: 2012-02-14
- 发明人: Wade D. Vinson , Paul R. Culley , Thomas D. Rhodes
- 申请人: Wade D. Vinson , Paul R. Culley , Thomas D. Rhodes
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
A computer-implemented method is used for determining cooling requirements of a computer system enclosure, where the enclosure includes a number of installed modules, the modules including fan modules. The method includes the steps of determining an individual impedance curve of each installed module; determining fan curves for the installed fan modules; based on the individual impedance curves, determining an overall system impedance curve for the computer system; determining desired performance requirements for the computer system; based on the desired performance requirements, determining corresponding fan curves; and choosing a fan curve that intersects the system impedance curve.
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